eTraining Introduction

Specimen Preparation

Leica Ultracut UCT



Hitachi S-4700 FE-SEM

Hitachi FB-2000A FIB


Veeco Dim 3000 AFM

Fluorescence Microscopes



Electronic Materials and Carbon Nanotubes

This type of sample is imaged using the Hitachi S-4700 FE-SEM.

Plan View

There are two orientations for thin films examination: plan view and cross-section. Mounting for plan view is accomplished by a) trimming the substrate to fit the aluminum mount and b) attaching the film to the mount with carbon tape. Nanotubes on substrates are mounted in the same fashion. It is possible to coat non-conductive films, but the coating itself may be visible at very high magnification (100k x or higher). It is usually possible to image uncoated films and nanotubes in the FESEM. This requires using very low voltage and short working distances.


Mounting for cross-sections first involves exposing the section. You can cleave, fracture or polish the edge depending on the goal of your study. See Cryo Fracture Technique under Specimen Preparation. Polishing is carried out on the MultiPrep™ System. See Multiprep Polishing Procedure under Specimen Preparation. There is a special FESEM holder for substrates that holds the edge in a vertical orientation. Be aware that the specimen + holder height matters with the FESEM.

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