Electron Optics Facility Capabilities

Automated qualitative and quantitative X-ray elemental microanalysis, boron to uranium utitlizing the EMPA and SEM.
Electron beam lithography via SEM.
Digital image collection from secondary and backscattered electron sources as well as X-ray maps, digital image and feature analysis and digital image output.
Preparation of inorganic materials for TEM examination.
Electron diffraction techniques including selected area and convergent beam methodologies.
X-ray elemental analysis, boron to uranium, of thinned specimens in TEM.
Complete metallographic sample preparation laboratory.
Complete darkroom facilities.
Gaton DuoMill ion beam milling instrument.
Gatan dimple grinder.
Allied High Tech Multi-Prep specimen preparation system.
Struers Tenupol electro-jet milling system.
Three vacuum carbon/metal evaporation units.
Two sputter coating sources.
Leica UCT ultramicrotome.
Four IBM compatible Pentium CPU's , three Mac G4 CPU's.
1200 dpi high resolution laser printer.
Two, 2400 dpi digital image transparency scanner.

SUPPORT

Use caution working with the Hummer sputter coater. Air dust the target area before coating.

Last updated October 15, 2007