eTraining Introduction

Specimen Preparation

Leica Ultracut UCT

Histology

JEOL JSM-6400 SEM

Hitachi S-4700 FE-SEM

Hitachi FB-2000A FIB

Microanalysis

Veeco Dim 3000 AFM

Fluorescence Microscopes

Support

Thin Sections

Equipment

RESIN INJECTOR

Logitech IU30

Logitech IU30 Impregnation Unit

About the IU30 Impregnation Unit - Logitech website

Geological Sciences - Thin Sections - Logitech website

   

GRINDERS

Dansk Beton Technic

Dansk-Beton Technic

Precision thin-section grinder for preparing thin sections of uniform thickness.

Lapmaster 12

Lapmaster 12, Crane Packing Company

Lapping plate, compound agitator, compound valve, timer.

CUTTERS

Ingram 103

Ingram Labs Model 103 Ingram Laboratories Model 103

Thin section cut-off saw.

Logitech CS 10

Logitech CS 10

Thin section cut-off saw.

Buehler Isomet 1000

Buehler Isomet 1000

Precision saw.

   

POLISHERS

Buehler Vibromet 1

Buehler Vibromet 1

Vibratory polisher.

Buehler Ecomet 4

Buehler Ecomet 4

Variable speed grinder/polisher with Automet 2 power head.

LECO AP 50

LECO AP-50 Automatic Polishing Machine

LECO AP 300

LECO AP-300 Automatic Polishing Machine

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